Solderless Breadboard 830 Tiepoints

Solderless Breadboard 830 Tiepoints

Description

• 830 tiepoints, suitable for electronic circuit assembly / debugging / training
• Solder free, time saving, reusable with clear structure, widely used in experiments and tests
• Multiple pieces can be spliced together to make a larger bread board, suitable for large circuit construction
• Made of ABS with Tin plated phosphor bronze contact, providing superior conductivity and improving the test efficiency
• Small in size, easy to carry, with double-sided adhesive tape on the back, can be adhered to the bottom plate for easier use